Line-up Product feature Single shipper for 50,75 wafer Σ-300 FOSB SS300  Factors that chemically contaminate wafer are classified three such as; (1) organic contamination, (2) metal contamination and (3) inorganic contamination.  VANTEC use pure materials that have less influence of these contamination source, so it is possible to transport wafer cleanly.  In the contamination evaluation on wafer surface, VANTEC also evaluates in high precision method of micro-contamination by TD-GC/MS, ICP, ion-exchange chromatography, etc. Also in any evaluation of ∑ -series, VANTEC is achieving lower organic contamination than other companies or α -series.   (1) In wafer diameter less than 150mm Σ / α -series, VANTEC use wafer arc used unique soft cushion and soft support structure at O.F. part. Therefore it is possible to transport background wafer(250 μ m) safely. (2) In wafer diameter 200mm, it also has shock-proof performance equal to or more than the above by installing elastic material (option), and the back-grind wafer transport is also possible.   (1) Visibility   In all types of box of Σ -series, transparent material is used for cover. The box inside becomes visible, and wafer existence and quantity can be easily checked. (2) Optimum sealing/no taping   In a small diameter wafer box of other company, the box opening is sealed with tape when packaging and transporting. All types of box of VANTEC do not need sealing tape because air tight performance of box is maintained with gasket.    VANTEC changed Σ -series material, and has provided Ω -series having antistatic performance.  VANTEC also realized the following volume resistant value of each part, and keep permanent antistatic performance. (Volume resistant value (Ω) Cover: , Bottom: )   Σ -series consists of single material on each part, and products can be recycled by crushing every each part after its use.   Each size of cassette are based on SEMI standard. Copyright(C)2008 VANTEC CO., LTD. All Rights Reserved.