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Line-up Product feature Single shipper for 50,75 wafer Σ-300 FOSB SS300
   Polycarbonate (PC) and polybutylene terephthalate (PBT) are used for Cover/Case and cushion (wafer holding part) respectively, and wafer for compound semi-conductor can be therefore transported cleanly. Particle generated volume can be lowered by using materials (PC and PBT) that have anti-abrasion performance.
   Cover + cushion (wafer holder) or Case + cushion can be fitted, so cushion can be joining with cap/case while opening and closing.
 Also since circumferential shape is octopus, cap tightness can be easily and visually checked. And since cap and case are transparent, wafer can be easily checked.
 
 
  Components and materials Total dimension(mm) Total weight(g) Download
Cover Cushion Case Diameter Height Part figure Three figures
SS50 PC PBT PC 63 14 18
SS75 PC PBT PC 91 14 37
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